Infineon Launches 650V GaN Module for High-Voltage Use
Infineon Launches EasyPACK™ CoolGaN™ 650 V Module to Address Surging Global Electricity Demand
In response to the anticipated surge in global electricity demand driven by the rapid expansion of AI data centers, the increasing adoption of electric vehicles (EVs), and the ongoing trends in global digitalization and reindustrialization, Infineon Technologies AG, a global leader in semiconductor solutions, has introduced the EasyPACK™ CoolGaN™ Transistor 650 V module. This new addition to Infineon’s growing Gallium Nitride (GaN) power portfolio is based on the well-established Easy Power Module platform and has been specifically developed to cater to high-power applications such as data centers, renewable energy systems, and DC electric vehicle charging stations. The module is meticulously designed to meet the escalating demand for higher performance while ensuring maximum ease of use, thereby enabling customers to accelerate their design processes and significantly shorten their time-to-market.
According to Roland Ott, Senior Vice President and Head of the Green Energy Modules and Systems Business Unit at Infineon, "The CoolGaN-based EasyPACK power modules seamlessly combine Infineon’s extensive expertise in both power semiconductors and advanced power modules. This powerful combination offers our customers a compelling solution that effectively meets the increasing demand for high-performance and energy-efficient technologies in critical applications such as data centers, renewable energy generation, and the rapidly expanding EV charging infrastructure."
The EasyPACK CoolGaN module strategically integrates 650 V CoolGaN power semiconductors characterized by ultra-low parasitic inductances. This is achieved through highly compact die packing within the module, which ultimately enables exceptionally fast and efficient switching performance. Delivering an impressive power output of up to 70 kW per phase with just a single module, the EasyPACK CoolGaN solution supports the development of highly compact and easily scalable high-power systems. Furthermore, by synergistically combining Infineon's robust .XT interconnect technology with the advanced CoolGaN power switches, the module achieves significant enhancements in both overall performance and long-term reliability. The .XT interconnection technology is implemented on a high-performance substrate, leading to a substantial reduction in thermal resistance. This reduction in thermal impedance directly translates to higher system efficiency and lower cooling requirements, ultimately resulting in increased power density and excellent cycling robustness, even under the most demanding operating conditions. With comprehensive support for a broad range of power circuit topologies and flexible customization options, the EasyPACK CoolGaN module effectively addresses the diverse and evolving requirements of industrial and energy applications.
About EasyPACK:
Infineon has achieved a remarkable milestone, having sold well over 70 million EasyPACK modules incorporating various chipset technologies for a wide spectrum of industrial and automotive applications. With the strategic introduction of CoolGaN power semiconductors into this well-established package platform, Infineon is now significantly expanding the application range of GaN technology, particularly as its inherent advantages create increasing demand in very high kilowatt power applications. The EasyPACK series leverages Infineon’s proven PressFIT contact technology, which ensures highly reliable and exceptionally durable electrical connections between the power module and the underlying PCB. By utilizing an advanced cold-welding process, PressFIT technology creates gas-tight, solder-free joints that guarantee long-term mechanical stability and superior electrical conductivity, even when subjected to demanding thermal and mechanical stresses. This sophisticated design not only reduces manufacturing time and complexity but also effectively eliminates potential solder-related defects, offering a highly robust and reliable solution for critical high-reliability applications. Additionally, the compact design of EasyPACK modules allows them to occupy up to 30 percent less PCB surface area compared to other conventional discrete component layouts, resulting in a very cost-effective and space-efficient overall system solution.
About CoolGaN Transistors 650 V G5:
The newest generation of 650 V CoolGaN transistors represents a significant leap forward in performance and key figures of merit. Infineon’s comprehensive benchmark data demonstrates that CoolGaN Transistor 650 V G5 products offer up to 50% lower energy stored in the output capacitance (Eoss), up to 60% improved drain-source charge (Qoss), and up to 60 percent lower gate charge (Qg). When combined, these superior characteristics result in significantly increased efficiencies in both hard-switching and soft-switching power converter topologies. This translates to a substantial reduction in overall power loss compared to traditional silicon-based power technology, ranging from 20 to 60% depending on the specific application and operating conditions. The CoolGaN Transistor 650 V G5 product family offers a wide and diverse range of RDS(on) and package combinations. Ten distinct RDS(on) classes are currently available in various Surface Mount Device (SMD) packages, including ThinPAK 5x6, DFN 8x8, TOLL, and TOLT, providing designers with a multitude of options to optimize their designs.
All CoolGaN products are manufactured on Infineon’s high-performance 8-inch production lines located in Villach, Austria, and Kulim, Malaysia, ensuring high-volume and reliable supply. Target applications for the CoolGaN transistor family span a wide range, from consumer and industrial switched-mode power supplies (SMPS) such as USB-C adapters and chargers, lighting systems, televisions, data center power rectifiers, and telecom power rectifiers, to renewable energy systems and motor drives in home appliances.
Availability:
Infineon will be showcasing the new EasyPACK modules incorporating CoolGaN technology at the upcoming PCIM 2025 exhibition in Nuremberg, Germany, at the Infineon booth located in Hall 7, Booth 470.
BonChip Electronics is a proud distributor of Infineon Technologies' comprehensive portfolio of high-quality power semiconductor solutions, including the groundbreaking EasyPACK™ CoolGaN™ Transistor 650 V module. We offer full product sales and ordering services for Infineon's complete range, ensuring our customers have access to the latest advancements in Gallium Nitride (GaN) power technology for their data center, renewable energy, and EV charging applications. With a strong commitment to providing the best service and the most convenient delivery options, BonChip Electronics is your trusted partner for sourcing all your Infineon component requirements. Contact us today to learn more about how the EasyPACK CoolGaN module can enhance the efficiency, power density, and ease of design in your high-power systems.
